Sankara J Subramanian

Associate Professor

Ph.D., University of Illinois at Urbana-Champaign
M.S, University of Illinois at Urbana-Champaign
B.Tech, Indian Institute of Technology Madras

Email: shankar_sj[at]iitm.ac.in
Phone: Extn. 4737 (+91 44 2257 4737)
Page Link: http://ed.iitm.ac.in/~shankar_sj/

Professional Experience

  • Staff Engineer, IBM, Endicott, NY, USA
  • Senior Packaging Engineer, Intel, Chandler, AZ, USA
  • Principal Materials Engineer, Medtronic, Tempe, AZ, USA

Areas of Research

  • Mechanical Behaviour of Materials, Digital Image Correlation, Eigenfunction Virtual Fields Method

Courses Taught

  • ED 2120: Mechanics of Deformable Solids
  • ED 3160: Deformation and Failure of Engineering Materials
  • ED 4030: Finite Element Method
  • ED 5312: Materials and Manufacturing for the Automotive Industry

Publications(Last 5 Years)

  • Modeling the interaction between densification mechanisms in powder compaction, S.J. Subramanian and P.Sofronis, International Journal of Solids and Structures, 38 (2001), pp. 7899-7918
  • A constitutive law for powder densification driven by interparticle and pore surface diffusion, S. J.Subramanian and P. Sofronis, International Journal of Mechanical Sciences, 44 (2002), pp. 2239-2262
  • Void Growth in Power-Law Creeping Solids: Effect of Surface Diffusion and Surface Energy, S. J. Subramanian, P. Sofronis and P. Ponte-Castaneda, International Journal of Solids and Structures, 42 (2005), pp. 6202-6225

Awards & Patents

Awards

  • Stanley Weiss Award for Outstanding Thesis, 2001, Department of Theoretical and Applied Mechanics, University of Illinois at Urbana Champaign

Patents

  • Semiconductor package integral heat spreader, Intel Corporation
  • Micro-electronic assembly having a periphery seal around a thermal interface material, Intel Corporation
  • Flexible core for enhancement of package interconnect reliability, Intel Corporation
  • Embedded capacitors for reducing package cracking, Intel Corporation
  • Compliant structure for an electronic device, method of manufacturing same, and system containing same, Intel Corporation
  • No-flow underfill device and method, Intel Corporation
  • Underfill device and method, Intel Corporation