Portrait

B. Tech., Mechanical Engineering, IIT Madras, 1993
Ph. D., Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, 2001

416, Department of Engineering Design, IIT Madras, Chennai 600 036
Ph: 91-44-2257-4737
email: shankar_sj AT iitm DOT ac DOT in

Areas of Interest

    Mechanical Behaviour of Materials
    Digital Image Correlation
    Eigenfunction Virtual Fields Method
      Constitutive Behaviour of Solders

Current Courses

    ED 2120: Mechanics of Deformable Solids
    ED 3160: Deformation and Failure of Engineering Materials
    ED 4030: Finite Element Method for Design
    ED 4503: Design Project in Industry
    ED 5312: Materials and Manufacturing for the Automotive Industry
    MS 1100: (contributor) Technology, Invention and Innovation
    ID 1100: (contributor) Concepts in Engineering Design

Professional Experience

    2001-2002: Staff Engineer, IBM, Endicott, NY, USA
    2002-2006: Senior Packaging Engineer, Intel, Chandler, AZ, USA
    2006-2009: Principal Materials Engineer, Medtronic, Tempe, AZ, USA

Representative Publications

    Identification of Orthotropic Elastic Constants Using the Eigenfunction Virtual Fields Method, N. Nigamaa and S. J. Subramanian, International Journal of Solids and Structures, Accepted for Publication
    Computation of full-field strains using Principal Component Analysis, S. N. Grama and S. J. Subramanian, Experimental Mechanics, Accepted for Publication
    Modeling the interaction between densification mechanisms in powder compaction, S. J. Subramanian and P. Sofronis, International Journal of Solids and Structures, 38 (2001), pp. 7899-7918
    A constitutive law for powder densification driven by interparticle and pore surface diffusion, S. J. Subramanian and P. Sofronis, International Journal of Mechanical Sciences, 44 (2002), pp. 2239-2262
    Void Growth in Power-Law Creeping Solids: Effect of Surface Diffusion and Surface Energy, S. J. Subramanian, P. Sofronis and P. Ponte-Castaneda, International Journal of Solids and Structures, 42 (2005), pp. 6202-6225

Patents Pending/Awarded (with others)

    Semiconductor package integral heat spreader, Intel Corporation
    Micro-electronic assembly having a periphery seal around a thermal interface material, Intel Corporation
    Flexible core for enhancement of package interconnect reliability, Intel Corporation
    Embedded capacitors for reducing package cracking, Intel Corporation
    Compliant structure for an electronic device, method of manufacturing same, and system containing same, Intel Corporation
    No-flow underfill device and method, Intel Corporation
    Underfill device and method, Intel Corporation
    A method for non-destructive structural health monitoring, IIT Madras
    A method to compute strains from full-field data, IIT Madras
    Orthodontic device and method, IIT Madras