B. Tech., Mechanical Engineering, IIT Madras, 1993
Ph. D., Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, 2001
416, Department of Engineering Design, IIT Madras, Chennai 600 036
Ph: 91-44-2257-4737
email: shankar_sj AT iitm DOT ac DOT in
Areas of Interest
- Mechanical Behaviour of Materials
- Digital Image Correlation
- Eigenfunction Virtual Fields Method
- Constitutive Behaviour of Solders
Current Courses
- ED 2120: Mechanics of Deformable Solids
- ED 3160: Deformation and Failure of Engineering Materials
- ED 4030: Finite Element Method for Design
- ED 4503: Design Project in Industry
- ED 5312: Materials and Manufacturing for the Automotive Industry
- MS 1100: (contributor) Technology, Invention and Innovation
- ID 1100: (contributor) Concepts in Engineering Design
Professional Experience
- 2001-2002: Staff Engineer, IBM, Endicott, NY, USA
- 2002-2006: Senior Packaging Engineer, Intel, Chandler, AZ, USA
- 2006-2009: Principal Materials Engineer, Medtronic, Tempe, AZ, USA
Representative Publications
- Identification of Orthotropic Elastic Constants Using the Eigenfunction Virtual Fields Method, N. Nigamaa and S. J. Subramanian, International Journal of Solids and Structures, Accepted for Publication
- Computation of full-field strains using Principal Component Analysis, S. N. Grama and S. J. Subramanian, Experimental Mechanics, Accepted for Publication
- Modeling the interaction between densification mechanisms in powder compaction, S. J. Subramanian and P. Sofronis, International Journal of Solids and Structures, 38 (2001), pp. 7899-7918
- A constitutive law for powder densification driven by interparticle and pore surface diffusion, S. J. Subramanian and P. Sofronis, International Journal of Mechanical Sciences, 44 (2002), pp. 2239-2262
- Void Growth in Power-Law Creeping Solids: Effect of Surface Diffusion and Surface Energy, S. J. Subramanian, P. Sofronis and P. Ponte-Castaneda, International Journal of Solids and Structures, 42 (2005), pp. 6202-6225
Patents Pending/Awarded (with others)
- Semiconductor package integral heat spreader, Intel Corporation
- Micro-electronic assembly having a periphery seal around a thermal interface material, Intel Corporation
- Flexible core for enhancement of package interconnect reliability, Intel Corporation
- Embedded capacitors for reducing package cracking, Intel Corporation
- Compliant structure for an electronic device, method of manufacturing same, and system containing same, Intel Corporation
- No-flow underfill device and method, Intel Corporation
- Underfill device and method, Intel Corporation
- A method for non-destructive structural health monitoring, IIT Madras
- A method to compute strains from full-field data, IIT Madras
- Orthodontic device and method, IIT Madras