My group works on developing tools, both computational and experimental, for quality-assured mechanical design. A robust mechanical reliability framework rests on several key abilities: fundamental understanding of the properties of the materials and structures involved, knowledge of the statistics of failure, comprehension of the field use conditions that are relevant to the design and expertise in implementing computational tools necessary to model deformation and failure of today'ís advanced materials.
Presently, we are working on building a Digital Image Correlation (DIC) system in our lab. DIC is a non-contact metrology for measuring displacements and strains. This technique relies on correlating images of a deformed specimen with that in its undeformed state, and the displacements of hundreds of grid locations in a sample can be measured. Apart from being a full-field non-contact technique, DIC offers other distinct advantages over conventional techniques such as strain gages. It can be used to quantify material inhomogeneity, can be used at high temperature without significant modification, is suitable for soft materials, and can take images from a variety of sources, such as digital cameras, SEM, AFM etc.
On the computational side, we are using the Virtual Fields Method to calculate viscoplastic properties of solders from Digital Image Correlation data obtained from double lap-shear test data. Our activities are at an early stage, so please check back periodically for updates. For additional information, feel free to send me email.